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Bicheng Technologies Limited
M4, TC350
Active Member
4 Years
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M4, TC350
4 Years
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| Brand Name : | Bicheng Technologies Limited |
| Model Number : | BIC-0158-N0.158 |
| Certification : | UL |
| Price : | USD9.99-99.99 |
| Payment Terms : | T/T/Paypal |
| Supply Ability : | 50000 pieces per month |
| Delivery Time : | 10 working days |
Thermoset Rogers TMM 6 microwave material 50 mil 1.27 mm laminates with an immersion gold
dielectric constant of 6.0.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
This high-frequency PCB is constructed on a 50mil TMM6 substrate with a dielectric constant (DK) of 6.0
during the manufacturing process. It is designed as a double-layer circuit board featuring 1oz copper and
immersion gold on the pads. The via holes, sized at 0.3mm, are filled with resin and topped with copper
caps for enhanced durability and conductivity.
The boards are coated with a green solder mask, providing insulation and protection. Manufactured in
compliance with the IPC Class II standard, these PCBs adhere to industry-recognized quality benchmarks.
For shipping convenience and protection, batches of 25 boards are vacuum-packed, ensuring they reach
their destination in optimal condition, ready for deployment in various high-frequency applications.
PCB Specifications
| PCB SIZE | 117 x 88mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| TMM6 1.270mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.30 mm / 2.0 mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 2500 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | no |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | TMM6 1.270mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.4mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold, 59% |
| Solder Mask Apply To: | Top Layer and Bottom Layer |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Component Side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Kuangshun |
| VIA | Plated through hole(PTH), minimum size 0.30mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our PCB Capability(TMM6)
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM6 |
| Dielectric constant: | 6 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Data Sheet of TMM6
| Property | TMM6 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 6.0±0.08 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 6.3 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0023 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -11 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 10^8 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 1 x 10^9 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 362 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 18 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 18 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 26 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.72 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 15.02 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.75 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 | |||||
| Specific Gravity | 2.37 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.78 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
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