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Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power

Bicheng Technologies Limited
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    Buy cheap Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power from wholesalers
     
    Buy cheap Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power from wholesalers
    • Buy cheap Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power from wholesalers
    • Buy cheap Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power from wholesalers

    Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0126-N0.126
    Certification : UL
    Price : USD9.99-99.99
    Payment Terms : T/T/Paypal
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
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    Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG for involving high power

    Rogers High-Frequency Laminates RT/duroid 6035HTC PCB circuit board materials 20mil with ENIG

    for applications involving high power radiofrequency and microwaves.

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    RT/duroid 6035HTC by Rogers Corporation:

    1.Product Description:
    RT/duroid 6035HTC, part of Rogers Corporation's high-frequency circuit materials, is a premium ceramic-filled

    PTFE composite tailored for high-power RF and microwave applications.


    2.Key Advantages:

    Enhanced Thermal Conductivity: Boasting a thermal conductivity almost 2.4 times that of standard RT/duroid 6000

    products, RT/duroid 6035HTC excels in efficiently dissipating heat, critical for high-power scenarios.


    3.Copper Foil Stability: Featuring copper foil with electrodeposited and reverse treatment, this material ensures

    outstanding long-term thermal stability, guaranteeing consistent performance over extended periods.


    4.Ideal Applications:
    RT/duroid 6035HTC laminates are the go-to choice for high-power applications where reliable heat management is

    paramount. Its superior thermal conductivity and stable copper foil make it a preferred solution for demanding RF

    and microwave environments.


    5.Conclusion:
    Rogers Corporation's RT/duroid 6035HTC sets a high standard in high-frequency circuit materials, offering exceptional

    heat dissipation capabilities and long-term stability. This makes it a top choice for high-power RF and microwave

    applications that demand reliability and efficiency.



    Features/Benefits:

    1.High Thermal Conductivity:
    Enhanced dielectric heat dissipation facilitates lower operating temperatures, ideal for high-power applications.

    2.Low Loss Tangent:
    Exceptional high-frequency performance due to minimal loss tangent, ensuring efficient signal transmission.

    3.Thermally Stable Copper Foil:
    Utilization of low-profile and reverse-treated copper foil results in reduced insertion loss and excellent thermal

    stability of traces.


    Advanced Filler System:
    Incorporation of an advanced filler system enhances drillability and prolongs tool life compared to alumina-containing

    circuit materials.


    Typical Applications:

    1.High Power RF and Microwave Amplifiers:
    Ideal for applications requiring robust thermal management and high power handling capabilities in RF and microwave

    amplifier circuits.


    2.Power Amplifiers, Couplers, Filters:
    Well-suited for power amplifiers, couplers, and filters where low loss tangent and stable thermal characteristics are

    essential for optimal performance.


    3.Combiners, Power Dividers:
    Suitable for combiners and power dividers necessitating reliable thermal stability and efficient signal transmission in

    high-power settings.



    PCB Capability (RT/duroid 6035HTC)

    PCB Material:Ceramic-filled PTFE composites
    Designation:RT/duroid 6035HTC
    Dielectric constant:3.50±0.05
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    Data Sheet of RT/duroid 6035HTC

    PropertyRT/duorid 6035HTCDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.50±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.6Z8 GHz - 40 GHzDifferential Phase Length Method
    Dissipation Factor0.0013Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-66Zppm/℃-50 to 150mod IPC-TM-650, 2.5.5.5
    Volume Resistivity108MΩ.cmAIPC-TM-650, 2.5.17.1
    Surface Resistivity108AIPC-TM-650, 2.5.17.1
    Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
    Tensile Modulus329 244MD CMDkpsi40 hrs @23/50RHASTM D638
    Moisure Absorption0.06%D24/23IPC-TM-650 2.6.2.1 ASTM D570
    Coefficient of Thermal Expansion (-50 to 288 )19 19 39X Y Zppm/23 / 50% RHIPC-TM-650 2.4.41
    Thermal Conductivity1.44W/m/k80ASTM C518
    Density2.2gm/cm323ASTM D792
    Copper Peel Stength7.9pli20 sec. @288 IPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes


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