F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

Introduction of F4BTM300:
Wangling's F4BTM300 laminates are meticulously crafted by blending fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin through precise pressing processes. Leveraging the F4BM dielectric layer as a foundation,

the F4BTM300 series integrates high dielectric and low loss nano-level ceramics, enhancing the dielectric constant, heat resistance, thermal expansion coefficient, insulation resistance, and thermal conductivity while preserving low loss attributes.

F4BTM300 and F4BTME300 share a common dielectric layer but differ in copper foils: F4BTM employs ED copper foil,

suitable for applications not requiring PIM compliance, while F4BTME is paired with reverse-treated (RTF) copper foil,

ensuring superior PIM performance, precise line control, and reduced conductor loss.

Features of F4BTM300:

• Dielectric constant (Dk) of 3.0 at 10GHz
• Dissipation factor of 0.0018 at 10GHz
• Thermal expansion coefficient (CTE) in x-axis: 15 ppm/°C, y-axis: 16 ppm/°C, z-axis: 78 ppm/°C (-55°C to 288°C)
• Low thermal coefficient of Dk at -78 ppm/°C (-55°C to 150°C)
• Moisture absorption of less than 0.05%
• UL-94 V0 flammability rating

PCB Stackup:

• 2-layer rigid PCB
• Copper layer 1: 35 μm
• F4BTM300 Core: 1.016 mm (40mil)
• Copper layer 2: 35 μm
• PCB Construction Details:
• Board dimensions: 84.33mm x 59.5mm, 2 pieces, with a tolerance of ±0.15mm
• Minimum Trace/Space: 4/6 mils
• Minimum Hole Size: 0.3mm
• No blind vias
• Finished board thickness: 1.1mm
• Finished Cu weight: 1oz (1.4 mils) on outer layers
• Via plating thickness: 20 μm
• Surface finish: Immersion gold
• Top Silkscreen: White
• Bottom Silkscreen: None
• Top Solder Mask: Black
• Bottom Solder Mask: None
• 100% Electrical test conducted before shipment

PCB Statistics:

• Components: 16
• Total Pads: 47
• Thru-Hole Pads: 32
• Top SMT Pads: 15
• Bottom SMT Pads: 0
• Vias: 31
• Nets: 2

Additional Information:

1. Artwork Format: Gerber RS-274-X
2. Quality Standard: IPC-Class-2 compliant
3. Availability: Worldwide

Typical Applications:

• Microwave, RF, and radar systems
• Phase shifters
• Power dividers, couplers, combiners
• Feed networks
• Phase-sensitive antennas, phased array antennas
• Satellite communications
• Base station antennas

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Established in 2003, Bicheng Technologies Limited is a reputable supplier and exporter of high frequency PCBs based in Hong Kong, China. With 20 years of experience, we specialize in serving global markets in various fields such as cellular base station antennas, satellites, high frequency passive components, microstrip and band line circuits, millimeter wave equipment, radar systems, digital radio frequency antennas, and more.

Our high frequency PCBs primarily utilize materials from renowned brands including Rogers Corporation, Taconic, and Wangling, Shengyi and Zhongying etc. These materials offer a wide range of dielectric constants, ranging from 2.2 to 10.2, ensuring optimal performance for diverse applications.

In addition to high frequency PCBs, we also have dedicated divisions for FR-4 circuit boards, flexible circuits, and metal core PCBs. Our capabilities cover prototype development, small production runs, and large-scale mass production. We actively pursue high-value PCB projects such as HDI (high-density interconnects), quick turnarounds, impedance control, heavy copper, and backplane boards. This comprehensive approach allows us to offer a complete range of PCB products, catering to both low-end and high-end requirements.

Our PCBs find applications in various industries, including computer networking, safety and surveillance systems, power supply units, telecommunication devices, automotive electronics, medical apparatus and instruments, national defense, industrial equipment, and more. We are dedicated to delivering high-quality PCB solutions that meet the diverse needs of our customers.